Micromachined 28-GHz Power Divider in CMOS Technology

نویسندگان

  • Mehmet Ozgur
  • Mona E. Zaghloul
  • Michael Gaitan
چکیده

A broad-band power divider is presented in CMOS technology. The devices are realized by postprocessing chips that are fabricated in a standard 1.2m CMOS process. Developed postprocessing includes wire bonding for ground equalization, deposition of a stress-compensation layer, and selective etching of the silicon substrate. By employing coupled coplanar transmission lines, the area of dividers is minimized to 0.8 mm 2.1 mm. A 20–35-GHz power divider exhibits a coupling of 3.8 dB 0.6 dB.

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تاریخ انتشار 2000